Vibration severity monitor for a press die

ABSTRACT

A die monitoring system for use in a press machine includes a die element, a vibration severity monitor, and a monitor receiving portion. The vibration severity monitor is configured for monitoring a vibration severity condition of the die element. The monitor receiving portion is associated with the die element and includes a monitor cavity. This monitor cavity is configured for an operable mounting of the vibration severity monitor therewithin. A primary feature of the vibration severity monitor is that it can remain with a particular die throughout the lifetime thereof, even if the die is interchanged between machine presses.

BACKGROUND OF THE INVENTION

1. Field of the invention.

The present invention relates to vibration severity monitoring technology for press dies and specifically to the mounting of such a monitor relative to a die so as to remain with that die throughout its lifetime.

2. Description of the related art.

Vibration severity technology has been developed by The Minster Machine Company to provide analysis of any die within any press of a production facility (VibMan™), as described in U.S. Pat. No. 6,209,400; and analysis of all dies within a specific press (VibCoach™), as described in U.S. Pat. Applicant No. 09/487,688, filed Jan. 19, 2000.

However, a methodology has not been previously developed which analyzes the performance of a specific die, regardless of the press with which it is operating, during the life of a die. Essentially, none of the previous severity monitoring systems developed by Minster or by others is configured for remaining with a particular die throughout its lifetime.

What is needed in the art is a methodology, when licensed to a die manufacturer, that allows for the vibration severity technology to travel with a particular die and that provides the ability to certify the reliable performance of the die with any press, so that safe and reliable operation of both a particular press and a particular die can be assured.

SUMMARY OF THE INVENTION

The present invention (known as VibDie Technology) includes a sensor means or device for monitoring vibration or another operational/process severity condition with the sensor being mounted in a cavity of a sensor receiver portion associated with a given die, thereby allowing the sensor means to remain with the particular die throughout its lifetime.

The present invention, in one form thereof, relates to a die system for use in a machine press. The die system includes a die element, a vibration severity monitor, and a monitor receiving portion. The vibration severity monitor is configured for monitoring a vibration severity condition of the die element. The monitor receiving portion is associated with the die element and includes a monitor cavity. This monitor cavity is configured for an operable mounting of the vibration severity monitor therewithin.

The present invention, in another form, relates to a machine press. The machine press includes a first die and a second die operatively coupled with the first die. At least one of the first die and the second die constitutes a chosen die. Each chosen die has a monitor receiving portion and a process severity monitor associated therewith. The monitor receiving portion includes a monitor cavity, the process severity monitor being mounted in the monitor cavity. The process severity monitor is configured for monitoring a process severity condition of one of the chosen die members.

One advantage of the present invention is that the severity monitoring circuitry thereof can remain with the same die, even as the die is moved from press to press. Accordingly, the degree of reliability of a particular die can continue to be monitored. The system includes a port available to download historical data such that the system allows an operator to use historical severity information to define, record, and transmit wear data from grind event to grind event on the die.

Another advantage of the present invention is that the severity monitoring technology can be coupled with existing tracking instrumentation (e.g., VibTracker™) to allow capture of long-term and potential minute-by-minute operating data.

Yet a further advantage of the present invention is that it would facilitate real-time/online (via a wireless transmitter) and/or historically-captured (via tracking instrumentation) data to be sent to others (e.g., die manufacturer, press manufacturer, and/or customer), thereby making continuous certification of a particular die feasible.

An even another advantage of the present invention is that the VibDie™ technology provides a potential for a documented history of a die that can be used for warranty purposes.

An additional advantage of the present invention is that the technology can be used with new die systems or can be retrofit to existing ones.

A further advantage of the present invention is that the monitoring device can be rather small (potentially an Ascics Computer-on-a-Chip).

A yet further advantage of the present invention is that it is possible to output the data gathered thereby to one or more sources simultaneously (e.g., VibTracker™, VibDoctord™, die certification, and/or press certification branded products available from The Minster Machine Company of Minster, Ohio).

A yet additional advantage of the present invention is that the monitor is durable and could potentially be rated to 100 G to about 150 G, where G is equal to the force of gravity, with 20 G being a typical force level associated with a machine press.

An even further advantage of the present invention is that online/wireless data access and transmission of data could be used to alert key personnel when a die is outside its reliability parameters.

BRIEF DESCRIPTION OF THE DRAWINGS

The above-mentioned and other features and advantages of this invention, and the manner of attaining them, will become more apparent and the invention will be better understood by reference to the following description of at least one embodiment of the invention taken in conjunction with the accompanying drawings, wherein:

FIG. 1 is a schematic, partial cut-away view of a press machine employing a die system, including a process severity monitor carried therewithin, of the first embodiment of the present invention;

FIG. 2 is a schematic, partial cut-away view of a press machine employing a die system, including a process severity monitor carried therewithin, of the second embodiment of the present invention;

FIG. 3 is a schematic view of the process severity monitor of the present invention.

Corresponding reference characters indicate corresponding parts throughout the several views. The exemplifications set out herein illustrate at least one preferred embodiment of the invention, in one form, and such exemplifications are not to be construed as limiting the scope of the invention in any manner.

DETAILED DESCRIPTION OF THE INVENTION

FIGS. 1 and 2 illustrate the first and second embodiments of the present invention. Mechanical press 10A, as shown in FIG. 1, includes a die system 12A and a die carrying mechanism 14 (such as a crown or bolster). Similarly, mechanical press 10B, as shown in FIG. 2, includes a die system 12B as well as a die carrying mechanism 14. Each die system 12A, 12B includes a die element 16A, 16B (respectively), a monitor receiving portion 18A, 18B, and a process severity monitor 20. Where the two embodiments differ is related to the nature of the monitor receiving portion 18A, 18B. In the embodiment of FIG. 1, monitor receiving portion 18A is an integral part of die element 16A. Meanwhile, in the second embodiment, of FIG. 2, monitor receiving portion 18B is a separate plate attached to die element 16B.

Returning to FIG. 1, each die element 16A, 16B has a forming side 22 and a press mount side 24. Monitor receiving portion 18A, 18B is associated with press mount side 24 of the respective die element 16A, 16B. In the case of die element 16A, monitor receiving portion 18A is an integral portion of die element 16A. In the case of die element 16B, however, monitor receiving portion 18B is a separate plate that is attached to die element 16B. The ability to provide a monitor receiving portion 18B that is separate from die 16B is important in that it makes retrofitting of previously manufactured dies capable of being equipped with the process severity monitoring technology of the present invention.

Within a given monitoring receiving portion 18A, 18B is a monitor cavity 26 configured for the mounting of a process severity monitor 20 therewithin. Process severity monitor 20 is advantageously attached within monitor cavity 26 of monitor receiving portion 18A, 18B by a shock mounting process including shock mounting of the circuitry, but with the sensor hard mounted. Yet, it is understood that any various means of attachment including, e.g., adhesive, soldering, ultrasonic welding, or mechanical fastening may be employed.

Process severity monitor 20 functions similar to the VibCoach™ branded technology as set forth in U.S. patent application No. 09/487,688 herby incorporated by reference. Yet, in addition to providing for monitoring of vibration severity, it is within the scope of the present invention that the process severity monitor 20 could be extended to monitor other process variables as well, such as tipping moment and/or force, as per U.S. Pat. Nos. 6,466,840; and 6,467,356 (both assigned to The Minster Machine Company and hereby incorporated by reference thereto). The contents of U.S. Pat. No. 6,209,400 and U.S. patent application No. 09/487,688 are hereby incorporated by reference thereto. Additionally, other Minster patents which address vibration severity monitoring technology include U.S. Pat. Nos. 5,094,107; 6,114,965; and 6,466,840, each of which are incorporated by reference thereto.

Setting apart the severity monitor of the present invention from the severity monitor systems of previous systems is the placement of the severity monitor 20 in such a manner so as to be able to be mounted within a particular die element 16A, 16B and be able to remain with that particular element 16A, 16B throughout the lifetime thereof. Another feature which sets apart severity monitor 20 is the reduction of the size achieved therewith (potentially to a computer on a chip). With such a reduction in size, the mounting of such a severity monitor 20 in a monitor receiving portion 18A, 18B is greatly facilitated, requiring only that a rather small monitor cavity 26 be created in a given monitor receiving portion 18A, 18B. By being able to minimize the size of monitor cavity 26, the effect of such a monitor cavity 26 on the operation of a particular die element 16A, 16B should be minimized.

A schematic view of severity monitor 20 is presented in FIG. 3. Process severity monitor 20 includes a microprocessor 28, a memory 30, at least one sensor 32, at least one data input mechanism 34, a display 36 or at least a means to create an output to a display, a power source connection 38, and a data output link 40. Types of data which may be input through data input mechanism 34 are the press number, press information/data, and/or time, for example. Such data may in turn be stored in memory 30, which advantageously has a capacity of preferably at least about eight megabytes to accommodate the amount of data being collected over the life of a given die. While the use of an accelerometer (advantageously having a rating of 10 volts) as the sensor 32 has been found to be highly effective in determining vibration severity, it is understood that other sensors may be used instead of or in addition to an accelerometer, such sensors including but not limited to, velocity sensors, displacement sensors and/or load cells. The use of such other types of sensors 32 may prove especially useful in calculating process severity parameters other than vibration severity. The sensors 32 incorporated with process severity monitor 20 may range from standard size to a computer on a chip. However, major space savings may be afforded primarily with the downsizing of other components associated with process severity monitor 20.

Various elements may be used to fulfill the roles of parts 34-40 of process severity monitor 20. A keyboard, touch screen, keypad, a mouse, and/or other data entry mechanism may be used for data input device 34. Display 36 may be any one or more of a printer, screen, and/or other audio and/or visual indicator, as needed. Power source connection 38 may incorporate a battery and/or an electrical outlet, as convenient. Further, data link output 40 may be in the form of a modem, wireless transceiver, a data port, or other data linkage.

Data can be output via output link 40 to any one or more of a variety of data management mechanisms. Such mechanisms, as illustrated, can include historical tracking instrumentation (e.g,. VibTracker™), a direct-line analysis means (e.g., VibDoctor™ or VibAnalysis™) and/or an online Internet analysis means. Historical tracking instrumentation 42 can provide long-term, potentially minute-by-minute performance data for the operation of the die. Such accumulated data can then be forwarded, for example, to die certification software 48 and/or to press certification software 50 for warranty purposes and, of course, for certifying the reliable or non-reliable vibration severity operation of a particular die, regardless of the press that the die has been used with over its history.

In addition to being able to supply historical data tracking through tracking instrumentation 42, current/real-time data can be supplied through a given analysis means 44 and/or 46. Analysis means 44 is configured as a local data link, while online analysis means 46 permits transmission of the data to a remote site. This data can be transferred to the die manufacturer for die certification records, the press manufacturer for press certification records, the customer for production certification records, and/or operating personnel. It is useful to have the ability to relay real-time vibration severity data to the operating personnel so that they can be alerted when a die is operating outside its vibration severity reliability parameters (e.g., via MinStar™). The data output produced by analysis means 44 and/or 46 is schematically illustrated as analysis output 52.

While this invention has been described as having a preferred design, the present invention can be further modified within the spirit and scope of this disclosure. This application is therefore intended to cover any variations, uses, or adaptations of the invention using its general principles. Further, this application is intended to cover such departures from the present disclosure as come within known or customary practice in the art to which this invention pertains and which fall within the limits of the appended claims. 

1. A die system for use in a machine press, said die system comprising: a die element; a vibration severity monitor configured for monitoring a vibration severity condition of said die element; and a monitor receiving portion associated with said die element, said monitor receiving portion including a monitor cavity configured for an operable mounting of said vibration severity monitor therewithin.
 2. The die system of claim 1, wherein said die element is capable of use in any one of a chosen plurality of machine presses.
 3. The die system of claim 1, wherein said die element is covered by a warranty program, said vibration severity monitor being configured for generating vibration severity data for use in connection with said warranty program.
 4. The die system of claim 1, wherein said vibration severity monitor is configured for generating vibration severity data, said vibration severity monitor being configured for communicating said vibration severity data to another source in at least one of a real-time format and a historically-captured format.
 5. The die system of claim 4, wherein said vibration severity monitor includes a wireless transmitter configured for transmitting data online in a real-time format.
 6. The die system of claim 1, wherein said monitor receiving portion is one of an integral portion of said die element and a separate plate attached to said die element.
 7. The die system of claim 6, wherein said monitor receiving portion is a separate plate attached to said die element.
 8. The die system of claim 7, wherein said separate plate and an accompanying said vibration severity monitor are capable of being retrofit on an existing said die element.
 9. The die system of claim 1, wherein said vibration severity monitor is mounted in said monitor receiving portion in such a manner so as to remain with said die element throughout a die lifetime thereof.
 10. The die system of claim 9, wherein said vibration severity monitor circuit is shock mounted in said monitor receiving portion and said sensor is hard mounted.
 11. The die system of claim 1, wherein said vibration severity monitor is in the form of a computer-on-a-chip.
 12. The die system of claim 1, wherein said vibration severity monitor is operatively associated with at least one accelerometer configured for sensing an acceleration of said die element during use thereof.
 13. The die system of claim 1, wherein said vibration severity monitor is further configured for tracking a tipping moment severity of said die element.
 14. A machine press, comprising: a first die; and a second die operatively coupled with said first die, wherein at least one of said first die and said second die constitutes a chosen die, each said chosen die having a monitor receiving portion and a process severity monitor associated therewith, said monitor receiving portion including a monitor cavity, said process severity monitor being mounted in said monitor cavity, said process severity monitor being configured for monitoring a process severity condition of one said chosen die.
 15. The machine press of claim 14, wherein said monitor receiving portion is one of an integral portion of said one said chosen die and a separate plate attached to said one said chosen die. 